On August 22nd at 1:00 p.m. ET we are hosting a detailed discussion on wire bonders such as Kulicke and Soffa Industries (KLIC) and an update on the semiconductor industry we are hosting another call with Dylan Patel, Chief Analyst of SemiAnalysis. Mr. Patel will share his insights on models capacity for advanced wire bond, CIS, Auto, Power (heavy vs wedge), and traditional wire bonders. During our call we will discuss the re-purposing of wire bonding machines, health of the overall market, estimated backlogs among other topics. In addition, given the significant changes to the semi industry we will be having a broader conversation on areas of the semi industry he believes are interesting.
KLIC was also discussed by an investor as a short idea that can be accessed here:
KLIC Short Idea